Potting Process Simulation of Electronic Devices

By potting, electronic devices are completely surrounded by particle reinforced polyurethane resins to ensure their reliability. In the SOVEB project (Simulation-supported Optimization of the Potting Process of Electronic Components) we simulate this process using our FLUID software so that industrial enterprises are able to optimize their production steps. 

The rapid development of microelectronics has led to the fact that isolated electronic components increasingly are becoming highly integrated and modular component systems. This results, among other things, in a high heat production during operation. But also other requirements such as long-term stability and functional reliability increase with the complexity of the assemblies. To name one example: LEDs are sensitive electronic components and often require additional protection against mechanical damage, humidity and other environmental influences.

Particle Reinforced Resins for the Protection of Electronic Devices

In this case, polyurethane resins are a typical example of potting compounds for the complete surrounding of electronic components. They protect sensitive electronic components not only from shock, vibration, humidity, water, but also from overheating of embedded electronic devices.

The potting compounds achieve their high thermal conductivity by the adding of particles. The particles differ in shape, size and filler concentration. The potting compound of particle reinforced polyurethane resins resulting from this forms an extremely high-viscosity suspension, which is very challenging as far as simulations are concerned.